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Start Over Author "Tseng, M.H." Journal 2009 ieee international electron devices meeting (iedm)
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1. Enabling 3D-IC foundry technologies for 28 nm node and beyond: through-silicon-via integration with high throughput die-to-wafer stacking

Author

Chen, D.Y., primary, Chiou, W.C., additional, Chen, M.F., additional, Wang, T.D., additional, Ching, K.M., additional, Tu, H.J., additional, Wu, W.J., additional, Yu, C.L., additional, Yang, K.F., additional, Chang, H.B., additional, Tseng, M.H., additional, Hsiao, C.W., additional, Lu, Y.J., additional, Hu, H.P., additional, Lin, Y.C., additional, Hsu, C.S., additional, Shue, Winston S., additional, and Yu, C.H., additional

Published
2009
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