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In order to improve the electrical channel designs with FPC board, a novel FPC structure is proposed in this work. The new transmission line structure not only shows the merit of precise impedance control of FPC board but also avoids the common-mode issue which arises from the meshed ground. Moreover, the new transmission line structure is compatible with the traditional FPC manufacturing process and can be manufactured without extra cost. This proposed structure was validated with 3D EM simulation and experiment, and assured of the feasibility and practiced in mass production to implement PCI-Express signals on FPC successfully. [ABSTRACT FROM PUBLISHER]

A novel three-tap passive equalizer design is proposed in this work. Comparing with traditional passive equalizers, the proposed design has three-tap equalization and shows higher flexibility of design, which can compensate the ISI effectively which long channels bring and is easy to fabricate in multi-layer PCB process. Moreover, the significant improvement of eye opening and jitter are demonstrated with the adoption of the proposed equalizer in a long SAS 6Gbps channel. [ABSTRACT FROM PUBLISHER]