Search

Inherent reliability of Surface acoustic wave filters plays a key role for its application in the mobile communication systems. Construction analysis is an effective method for evaluating the inherent reliability of electronic components. This work provides a construction analysis process for the surface acoustic wave filters, which includes external encapsulation analysis, internal encapsulation analysis and chip-level analysis. The results show that oxidation occurs on the upper surface of the Al electrodes and leads to the formation of Al2O3. The break in the Al electrode stripe is observed.

Electromigration has a potential to be used as a process for microstructural design in ultrafine interconnects such as TSVs and microbumps. This study investigates the relationship between the electromigration and the microstructural evolution in a Cu/Sn-microbump/Cu structures through a modeling and simulation approach. The electromigration-induced polarity effect on the interfacial Cu6Sn5 and Cu3Sn compounds as well as the acceleration of the Cu pad consumption are found, as previously reported in experimental studies. In addition, the simulation results predict that the Cu6Sn5 grains at the anode become finer when an current is applied. The polarity effect is weaker when the pad size increases from 10 μm to 20 μm. In the larger microbump, the growth of the interfacial Cu6Sn5 is slower, while the growth of the interfacial Cu3Sn and the consumption of the Cu pad is faster. The growth of the interfacial IMCs and the consumption of the Cu pad at both electrodes are faster in the hourglass-shaped microbump. The interfacial Cu6Sn5 layer at the anode in the barrel-shaped microbumps appears to be convex, while concave in the hourglass-shaped microbump. The polarity effect becomes more pronounced when bulk Cu6Sn5 grains in the Sn microbump are dissolved and redeposited onto the interfacial Cu6Sn5 at the anode. The bulk Cu6Sn5 grains are predicted to migrate towards the anode driven by the electric current.