Author: "Cheung, Yiuming" / Journal: 2015 ieee 65th electronic components & technology conference (ectc) - Searchworks@Jio Institute Digital Library Search Results

Searchworks

Select search scope, currently: Articles

Catalog

books, media & more in Jio Institute collections

Articles

journal articles & other e-resources

Your search keyword '"Cheung, Yiuming"' showing total 1 results

Start Over Author "Cheung, Yiuming" Journal 2015 ieee 65th electronic components & technology conference (ectc)

1 results on '"Cheung, Yiuming"'

1. A high throughput and reliable thermal compression bonding process for advanced interconnections.

Author: Li, Ming, Tian, DeWen, Cheung, YiuMing, Yang, Lei, and Lau, John H.
Published: 2015
Full Text: View/download PDF

Catalog

Books, media, physical & digital resources

See catalog results