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The traditional reliability evaluation method based on T&E (Test and Evaluation) easily results in less efficient and more costly R&D process. However, reliability evaluation with only the thermal loading or the vibration loading cannot accurately simulate the environment of the usage, which therefore does not provide insights on how to avoid defects in the designing process as well. Therefore, the authors propose a novel method on thermal-vibration combined loading, whose reliability is evaluated based on simulation. This method loads environment combined with thermal and vibration upon the digital mock-up of electronic products through simulation technology, and gets the reliability evaluation results with the guidance of the Physics of Failure theory. The method is applied to some common electronic products. Reliability evaluation results are given, which provide reference for the design improvement.