1. A Method to Contain the Temperature Rise of a Press-Pack Thyristor during a Short Circuit Protection Operation
- Author
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Michael R. Jennings, Jose Ortiz Gonzalez, A. B. Renz, Tim C. Green, Dan Rogers, Philip Mawby, Guy William Clarke Baker, Ruizhu Wu, Erfan Bashar, and Li Ran
- Subjects
Materials science ,Multiphysics ,05 social sciences ,Thyristor ,020207 software engineering ,02 engineering and technology ,Heat sink ,Fault (power engineering) ,Temperature measurement ,Automotive engineering ,Clamping ,Die (integrated circuit) ,0202 electrical engineering, electronic engineering, information engineering ,0501 psychology and cognitive sciences ,Current (fluid) ,050107 human factors - Abstract
A new packaging structure for clamping the temperature of a thyristor die is analysed in this paper. The proposed structure aims to absorb the heat released from the thyristor during a short circuit protection operation, to maintain the temperature within a defined range even when the current through the thyristor is temporarily very high. The defined range is below the maximum tolerable temperature and is controlled by using phase-change material (PCM). This has the potential to reduce both space and cost when compared to traditional packaging structures which utilise heat sinks. In the course of this investigation, a thermal model of a thyristor is used for comparison. COMSOL Multiphysics was used to simulate the thyristor temperature during a fault and the effect that the PCM has on the thyristor temperature. Experiments have been performed to verify the models and validate the feasibility of the proposed concept.
- Published
- 2019
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