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In large-size flat panel display modules for TV applications, signaling channels designed on flexible printed circuit (FPC) cable or chip-on-film (COF) package are incomparably shorter than source PCBs, but they can play a significant role in determining overall signal integrity (SI) performance. This work analyzes interconnection designs on FPC cable and COF package in terms of impedance matching and crosstalk. It also provides channel design considerations and design guidelines for better SI performance in flexible channels on high-speed interface for large-size LCD TV applications.

In this work, we present the multiple high density capacitance options available to help achieve PDN target and go over the various aspects involved (modelling, system simulations and optimizations) to achieve a PI compliant HPC system PDN design

EMI (Electrical Magnetic Interference) regulation is strictly applied to display panel products, and it needs to be considered from IC design stage. In this work, we propose a virtual EMI simulation technique for TV products to simulate the EMI test of the CISPR 16 standard. The virtual EMI simulation implements both display panel and EMI measurement environment by Ansys HFSS simulation software, which enable to predict the EMI problem of the display panel products in IC design stage. The proposed simulation technique showed a good correlation with the EMI measurement results of the 55-inch 4K display model.