1. Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper
- Author
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Mehdi Mehrali, Hossein Shaki, Eva Zeqiraj, Carsten Gundlach, Morteza Alehosseini, Mingdong Dong, Alireza Dolatshahi-Pirouz, Kristoffer Almdal, Mohammadjavad Jahanshahi, Qiang Li, Firoz Babu Kadumudi, Tiberiu-Gabriel Zsurzsan, Arnold Knott, Mohsen Akbari, and Jon Trifol
- Subjects
Materials science ,Circular economy ,Nanotechnology ,02 engineering and technology ,7. Clean energy ,Nanocellulose ,All institutes and research themes of the Radboud University Medical Center ,Nanosilicate ,020401 chemical engineering ,Green electronics ,General Materials Science ,Thermal stability ,Electronics ,0204 chemical engineering ,Polyethylene naphthalate ,Flexible electronics ,chemistry.chemical_classification ,SDG 8 - Decent Work and Economic Growth ,Origami electronics ,Polymer ,021001 nanoscience & nanotechnology ,Environmentally friendly ,Manufacturing cost ,Reconstructive and regenerative medicine Radboud Institute for Molecular Life Sciences [Radboudumc 10] ,chemistry ,13. Climate action ,SDG 12 - Responsible Consumption and Production ,0210 nano-technology - Abstract
Today's consumer electronics are made from nonrenewable and toxic components. They are also rigid, bulky, and manufactured in an energy-inefficient manner via CO2-generating routes. Though petroleum-based polymers such as polyethylene terephthalate and polyethylene naphthalate can address the rigidity issue, they have a large carbon footprint and generate harmful waste. Scalable routes for manufacturing electronics that are both flexible and ecofriendly (Fleco) could address the challenges in the field. Ideally, such substrates must incorporate into electronics without compromising device performance. In this work, we demonstrate that a new type of wood-based [nanocellulose (NC)] material made via nanosilicate (NS) reinforcement can yield flexible electronics that can bend and roll without loss of electrical function. Specifically, the NSs interact electrostatically with NC to reinforce thermal and mechanical properties. For instance, films containing 34 wt % of NS displayed an increased young's modulus (1.5 times), thermal stability (290 โ 310 °C), and a low coefficient of thermal expansion (40 ppm/K). These films can also easily be separated and renewed into new devices through simple and low-energy processes. Moreover, we used very cheap and environmentally friendly NC from American Value Added Pulping (AVAP) technology, American Process, and therefore, the manufacturing cost of our NS-reinforced NC paper is much cheaper ($0.016 per dm-2) than that of conventional NC-based substrates. Looking forward, the methodology highlighted herein is highly attractive as it can unlock the secrets of Fleco electronics and transform otherwise bulky, rigid, and "difficult-to-process" rigid circuits into more aesthetic and flexible ones while simultaneously bringing relief to an already-overburdened ecosystem.
- Published
- 2020
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