A series of strong, rebondable polydisulfide nanocomposite adhesive films have been prepared via the oxidation of a thiol-endcapped semicrystalline oligomer with varying amounts of thiol-functionalized cellulose nanocrystals (CNC-SH). The nanocomposites are designed to have two temperature-sensitive components: (1) the melting of the semicrystalline phase at ca. 70 °C and (2) the inherent dynamic behavior of the disulfide bonds at ca. 150 °C. The utility of these adhesives was demonstrated on different bonding substrates (hydrophilic glass slides and metal), and their bonding at both 80 and 150 °C was examined. In all cases, stronger bonding was achieved at temperatures where the disulfide bonds are dynamic. For high surface energy substrates, such as hydrophilic glass or metal, the adhesive shear strength increases with CNC-SH content, with the 30 wt % CNC-SH composites exhibiting adhesive shear strengths of 50 and 23 MPa for hydrophilic glass and metal, respectively. The effects of contact pressure and time of bonding were also investigated. It was found that ca. 20-30 min bonding time was required to reach maximum adhesion, with adhesives containing higher wt % CNCs requiring longer bonding times. Furthermore, it was found that, in general, an increase in contact pressure results in an increase in the shear strength of the adhesive. The rebonding of the adhesives was demonstrated with little-to-no loss in adhesive shear strength. In addition, the 30 wt % nanocomposite adhesive was compared to some common commercially available adhesives and showed significantly stronger shear strengths when bonded to metal.