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Passivating contacts consisting of heavily doped polycrystalline silicon (poly-Si) and ultrathin interfacial silicon oxide (SiO x ) films enable the fabrication of high-efficiency Si solar cells. The electrical properties and working mechanism of such poly-Si passivating contacts depend on the distribution of dopants at their interface with the underlying Si substrate of solar cells. Therefore, this distribution, particularly in the vicinity of pinholes in the SiO x film, is investigated in this work. Technology computer-aided design (TCAD) simulations were performed to study the diffusion of dopants, both phosphorus (P) and boron (B), from the poly-Si film into the Si substrate during the annealing process typically applied to poly-Si passivating contacts. The simulated 2D doping profiles indicate enhanced diffusion under pinholes, yielding deeper semicircular regions of increased doping compared to regions far removed from the pinholes. Such regions with locally enhanced doping were also experimentally demonstrated using high-resolution (5-10 nm/pixel) scanning spreading resistance microscopy (SSRM) for the first time. The SSRM measurements were performed on a variety of poly-Si passivating contacts, fabricated using different approaches by multiple research institutes, and the regions of doping enhancement were detected on samples where the presence of pinholes had been reported in the related literature. These findings can contribute to a better understanding, more accurate modeling, and optimization of poly-Si passivating contacts, which are increasingly being introduced in the mass production of Si solar cells.

We investigate hole-selective passivating contacts that consist of an interfacial layer of silicon oxide (SiO x ) and a layer of boron-doped SiC x (p). The fabrication process of these contacts involves an annealing step at temperatures above 750 °C which crystallizes the initially amorphous layer and diffuses dopants across the interfacial oxide into the wafer to facilitate charge transport, but it can also disrupt the SiO x layer necessary for wafer-surface passivation. To investigate the transport mechanism of the charge carriers through the selective contact and its changes during the annealing process, we utilize various characterization methods, such as transmission electron microscopy, micro Raman spectroscopy, and conductive atomic force microscopy. Combining the latter with a sequential removal of material, we assemble a tomographic reconstruction of the crystallized layer that reveals the presence of preferential vertical transport channels.

The use of passivating contacts compatible with typical homojunction thermal processes is one of the most promising approaches to realizing high-efficiency silicon solar cells. In this work, we investigate an alternative rear-passivating contact targeting facile implementation to industrial p-type solar cells. The contact structure consists of a chemically grown thin silicon oxide layer, which is capped with a boron-doped silicon-rich silicon carbide [SiC x (p)] layer and then annealed at 800-900 °C. Transmission electron microscopy reveals that the thin chemical oxide layer disappears upon thermal annealing up to 900 °C, leading to degraded surface passivation. We interpret this in terms of a chemical reaction between carbon atoms in the SiC x (p) layer and the adjacent chemical oxide layer. To prevent this reaction, an intrinsic silicon interlayer was introduced between the chemical oxide and the SiC x (p) layer. We show that this intrinsic silicon interlayer is beneficial for surface passivation. Optimized passivation is obtained with a 10-nm-thick intrinsic silicon interlayer, yielding an emitter saturation current density of 17 fA cm -2 on p-type wafers, which translates into an implied open-circuit voltage of 708 mV. The potential of the developed contact at the rear side is further investigated by realizing a proof-of-concept hybrid solar cell, featuring a heterojunction front-side contact made of intrinsic amorphous silicon and phosphorus-doped amorphous silicon. Even though the presented cells are limited by front-side reflection and front-side parasitic absorption, the obtained cell with a V oc of 694.7 mV, a FF of 79.1%, and an efficiency of 20.44% demonstrates the potential of the p + /p-wafer full-side-passivated rear-side scheme shown here.

While low hole mobilities limit the current collection and efficiency of hydrogenated amorphous silicon (a-Si:H) photovoltaic devices, attempts to improve mobility of the material directly have stagnated. Herein, we explore a method of utilizing nanostructuring of a-Si:H devices to allow for improved hole collection in thick absorber layers. This is achieved by etching an array of 150 nm diameter holes into intrinsic a-Si:H and then coating the structured material with p-type a-Si:H and a conformal zinc oxide transparent conducting layer. The inclusion of these nanoholes yields relative power conversion efficiency (PCE) increases of ∼45%, from 7.2 to 10.4% PCE for small area devices. Comparisons of optical properties, time-of-flight mobility measurements, and internal quantum efficiency spectra indicate this efficiency is indeed likely occurring from an improved collection pathway provided by the nanostructuring of the devices. Finally, we estimate that through modest optimizations of the design and fabrication, PCEs of beyond 13% should be obtainable for similar devices.