6 results on '"Lee, Hyuck"'
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2. Effects of phase composition and elemental partitioning on soft magnetic properties of AlFeCoCrMn high entropy alloys
3. Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure
4. Phenomenological phase diagram calculation of the NiAl system in the Ni-rich region
5. Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation
6. Thermodynamics-aided alloy design and evaluation of Pb-free solder, SnBiInZn system
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