1. Ground Simulation Method for Envelope Performance of Airship in near Space
- Author
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Shuai Cao, Pan Pan Mi, Long Bin Liu, and Ming Yun Lv
- Subjects
Weather resistance ,Coupling ,Engineering ,Simulation test ,business.industry ,General Engineering ,Process (computing) ,Radiation ,Aerospace engineering ,business ,Near space ,Envelope (motion) ,Overpressure - Abstract
Performing characteristics on envelope composite of near space airship (NSA) are quite different from that of the low altitude airship essentially. The NSA envelope material should meet excellent applicative characteristics including light weight, high strength, anti-aging, anti-ultraviolet radiation, gas-tightness, weather resistance. Ground simulation test is critical for the envelope design and development process of NSA, and the environmental features of near space is analyzed for NSA, then corresponding ground simulation test methods are proposed to involve mechanical strength of the ground test methods among the changing weather temperature and over pressure changes, materials weather resistance and air tightness test. Finally the coupling relationship between various mechanical test and environmental test methods is also investigated.
- Published
- 2014
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