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In permanent magnet applications, response often scales with volume or dimension in power-conversion and magnetostrictive applications, even in film form. In microelectromechanical devices it is necessary to explore versatile methods of dense film deposition with film thicknesses approaching one micron. In this study, we present a wet chemical route to hard magnetic cobalt ferrite (CoFe2O4) films to produce films with large coercivity, controllable thickness, saturation approaching that of the bulk, and smoother morphology than state-of-the art sputtered or pulsed-laser-deposited films. The development of etching and releasing processes demonstrates how these films are suitable for precise engineering in a variety of form factors and applications. [ABSTRACT FROM AUTHOR]