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1. Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules

Author

Chia-Chi Yu, Hsin-jay Wu, Matthias T. Agne, Ian T. Witting, Ping-Yuan Deng, G. Jeffrey Snyder, and Jinn P. Chu

Subjects
Biotechnology, TP248.13-248.65, Physics, QC1-999
Abstract

The thin film metallic glass (TFMG) is an effective diffusion barrier layer for PbTe-based thermoelectric (TE) modules. Reaction couples structured with Cu/TFMG/PbTe are prepared via sputter-deposition and are annealed at 673 K for 8-96 h. The transmission line method is adopted for the assessment of electrical contact resistivity upon the PbTe/TFMG, and the value remains in the range of 3.3-2.5 × 10−9 (Ω m2). The titanium-based TFMG remains amorphous upon annealing at 673 K for 48 h and effectively blocks the inter-diffusion by not having grain-boundaries, which only allows the bulk diffusion between the metal electrode and the TE substrate.

Published
2019
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2. Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules

Author

Ping Yuan Deng, Jinn P. Chu, Chia-Chi Yu, Hsin-Jay Wu, G. Jeffrey Snyder, Ian T. Witting, and Matthias T. Agne

Subjects
010302 applied physics, Materials science, Amorphous metal, Diffusion barrier, Annealing (metallurgy), lcsh:Biotechnology, General Engineering, 02 engineering and technology, Sputter deposition, 021001 nanoscience & nanotechnology, 01 natural sciences, Electrical contacts, lcsh:QC1-999, Amorphous solid, lcsh:TP248.13-248.65, 0103 physical sciences, Thermoelectric effect, General Materials Science, Thin film, Composite material, 0210 nano-technology, lcsh:Physics
Abstract

The thin film metallic glass (TFMG) is an effective diffusion barrier layer for PbTe-based thermoelectric (TE) modules. Reaction couples structured with Cu/TFMG/PbTe are prepared via sputter-deposition and are annealed at 673 K for 8-96 h. The transmission line method is adopted for the assessment of electrical contact resistivity upon the PbTe/TFMG, and the value remains in the range of 3.3-2.5 × 10−9 (Ω m2). The titanium-based TFMG remains amorphous upon annealing at 673 K for 48 h and effectively blocks the inter-diffusion by not having grain-boundaries, which only allows the bulk diffusion between the metal electrode and the TE substrate.

Published
2019

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