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We demonstrate the successful fabrication of large format (approximately 50 mm × 50 mm) gratings in monolithic silicon for use as high-efficiency grisms at infrared wavelengths. The substrates for the grisms were thick (8-16 mm) disks of precisely oriented single-crystal silicon (refractive index, n ~ 3.42). We used microlithography and chemical wet etching techniques to produce the diffraction gratings on one side of these substrates. These techniques permitted the manufacture of coarse grooves (as few as 7 grooves/mm) with precise control of the blaze angle and groove profile and resulted in excellent groove surface quality. Profilometric measurements of the groove structure of the gratings confirm that the physical dimensions of the final devices closely match their design values. Optical performance of these devices exceeds the specifications required for diffraction-limited performance (RMS wave surface error

Immersion gratings, diffraction gratings where the incident radiation strikes the grooves while immersed in a dielectric medium, offer significant compactness and performance advantages over front-surface gratings. These advantages become particularly large for high-resolution spectroscopy in the near-IR. The production and evaluation of immersion gratings produced by fabricating grooves in silicon substrates using photolithographic patterning and anisotropic etching is described. The gratings produced under this program accommodate beams up to 25 mm in diameter (grating areas to 55 mm x 75 mm). Several devices are complete with appropriate reflective and antireflection coatings. All gratings were tested as front-surface devices as well as immersed gratings. The results of the testing show that the echelles behave according to the predictions of the scalar efficiency model and that tests done on front surfaces are in good agreement with tests done in immersion. The relative efficiencies range from 59% to 75% at 632.8 nm. Tests of fully completed devices in immersion show that the gratings have reached the level where they compete with and, in some cases, exceed the performance of commercially available conventional diffraction gratings (relative efficiencies up to 71%). Several diffraction gratings on silicon substrates up to 75 mm in diameter having been produced, the current state of the silicon grating technology is evaluated.

We have fabricated large, coarsely ruled, echelle patterns on silicon wafers by using photolithography and chemical-etching techniques. The grating patterns consist of 142-microm-wide, V-shaped grooves with an opening angle of 70.6 degrees, blazed at 54.7 degrees. We present a detailed description of our grating-fabrication techniques and the results of extensive testing. We have measured peak diffraction efficiencies of 70% at lambda = 632.8 nm and conclude that the gratings produced by our method are of sufficient quality for use in high-resolution spectrographs in the visible and near IR (lambda approximately = 500-5000 nm).

We evaluated the optical performance of an IR echelle grating produced on a silicon wafer with anisotropic etching techniques. We measured the diffraction efficiency of a sample with a 55° blaze angle and 25-µm groove spacing. We also calculated the efficiency for typical triangular and trapezoidal groove profiles of etched gratings. The diffraction efficiency for unpolarized light can be approximately as high as the efficiency of right-angle groove gratings. The great potential of the etched silicon grating lies in its ease of fabrication, its excellent surface quality, and the high reproducibility of the production process. Compact high-resolution diffraction gratings can be produced by etching the grating pattern into the rear side of a transparent prism. When used in internal reflection, this increases the resolving power of the grating by a factor equal to the refractive index of the prism over a front surface grating of the same length.