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In this work, AlN polarization-enhancement interlayer (AlN-PEL) is adopted to enhance two-dimensional hole gas (2DHG) density in a p-GaN/AlN-PEL(∼2 nm)/AlGaN(<6 nm)/GaN heterostructure, aiming at monolithic integration of p/n-channel field effect transistors (p-FETs) on GaN-on-Si substrate. Owing to the strong built-in polarization of the AlN-PEL, high density 2DHG over 2.3 × 1013 cm−2 with good immunity to thermal freeze out effect is realized. Assisted by a two-step gate trench etching process, enhancement-mode (E-mode) buried-channel GaN p-FETs with temperature independent ON-resistance RON, and ON/OFF current ratio ION/IOFF (>108), have been fabricated. The fabricated p-FETs also deliver thermally stable subthreshold swing as well as threshold voltage Vth, and smaller Vth shift than that of p-FETs without the AlN-PEL, which is primarily due to enhanced 2DHG confinement by the AlN-PEL. The proposed structure is an attractive platform for monolithic integration of GaN-based logic and power devices for cryogenic applications as low as 10 K. [ABSTRACT FROM AUTHOR]

Threshold voltage (VTH) instability has been studied in the as-fabricated p-GaN gated enhancement-mode high electron mobility transistors (p-GaN E-HEMTs) under a positive gate stress. A negative VTH shift (ΔVTH) obtained by dynamic measurement has been observed more severely when compared to the static one. The VTH deviation is attributed to the complicated influence of carrier transport behaviors in the p-GaN gate. The impacts of hole accumulation, trapping, and consumption on the VTH instability and drain current variation can be effectively distinguished according to the transfer characteristics obtained from the pulse I–V measurement. Moreover, the density of hole traps in the p-GaN gate is estimated to be around ∼2 × 1011 cm−2 by the capacitance–voltage measurement, and the energy level is calculated to be around EV + 0.62 eV by fitting the recovery curve of gate current after positive gate bias. This study focusing on the in-depth influence of different carrier behaviors on the gate performance can help with the understanding and further improvement of the dynamic instability and reliability of the GaN-based HEMTs. [ABSTRACT FROM AUTHOR]