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Current conduction mechanism, including electron mobility, electron drift velocity (vd) and electrical break-down have been investigated in a 0.5 μm-thick (0001) InN layer grown by molecular-beam epitaxy on a GaN/sapphire template. Electron mobility (μ) of 1040 cm2/Vs and a free electron concentration (n) of 2.1 × 1018 cm−3 were measured at room temperature with only a limited change down to 20 K, suggesting scattering on dislocations and ionized impurities. Photoluminescence spectra and high-resolution X-ray diffraction correlated with the Hall experiment showing an emission peak at 0.69 eV, a full-width half-maximum of 30 meV, and a dislocation density Ndis ∼ 5.6 × 1010 cm−2. Current-voltage (I-V) characterization was done in a pulsed (10 ns-width) mode on InN resistors prepared by plasma processing and Ohmic contacts evaporation. Resistors with a different channel length ranging from 4 to 15.8 μm obeyed the Ohm law up to an electric field intensity Eknee ∼ 22 kV/cm, when vd ≥ 2.5 × 105 m/s. For higher ...

Critical aspects of InN channel field-effect transistors (FETs) have been investigated. SiNx dielectric layers were deposited in-situ, in the molecular beam epitaxy system, on the surface of 2 nm InN layers grown on GaN (0001) buffer layers. Metal-insulator-semiconductor Ni/SiNx/InN capacitors were analyzed by capacitance-voltage (C-V) and current-voltage measurements and were used as gates in InN FET transistors (MISFETs). Comparison of the experimental C-V results with self-consistent Schrodinger-Poisson calculations indicates the presence of a positive charge at the SiNx/InN interface of Qif ≈ 4.4 – 4.8 × 1013 cm−2, assuming complete InN strain relaxation. Operation of InN MISFETs was demonstrated, but their performance was limited by a catastrophic breakdown at drain-source voltages above 2.5–3.0 V, the low electron mobility, and high series resistances of the structures.

0.5–1 μm thick InN {0001} films grown by molecular-beam epitaxy with N- or In-polarity are investigated for the presence of native oxide, surface energy band bending, and effects introduced by 2 to 4 monolayers of GaN capping. Ex situ angle-resolved x-ray photo-electron spectroscopy is used to construct near-surface (GaN)/InN energy profiles, which is combined with deconvolution of In3d signal to trace the presence of InN native oxide for different types of polarity and capping. Downwards surface energy band bending was observed on bare samples with native oxide, regardless of the polarity. It was found that the In-polar InN surface is most readily oxidized, however, with only slightly less band bending if compared with the N-polar sample. On the other hand, InN surface oxidation was effectively mitigated by GaN capping. Still, as confirmed by ultra-violet photo-electron spectroscopy and by energy band diagram calculations, thin GaN cap layer may provide negative piezoelectric polarization charge at the GaN/InN hetero-interface of the N-polar sample, in addition to the passivation effect. These effects raised the band diagram up by about 0.65 eV, reaching a flat-band profile.

AlN/GaN high electron mobility transistor (HEMT) structures with thin GaN/AlN buffer layer have been analyzed theoretically and experimentally, and the effects of the AlN barrier and GaN buffer layer thicknesses on two-dimensional electron gas (2DEG) density and transport properties have been evaluated. HEMT structures consisting of [300 nm GaN/ 200 nm AlN] buffer layer on sapphire were grown by plasma-assisted molecular beam epitaxy and exhibited a remarkable agreement with the theoretical calculations, suggesting a negligible influence of the crystalline defects that increase near the heteroepitaxial interface. The 2DEG density varied from 6.8 × 1012 to 2.1 × 1013 cm−2 as the AlN barrier thickness increased from 2.2 to 4.5 nm, while a 4.5 nm AlN barrier would result to 3.1 × 1013 cm−2 on a GaN buffer layer. The 3.0 nm AlN barrier structure exhibited the highest 2DEG mobility of 900 cm2/Vs for a density of 1.3 × 1013 cm−2. The results were also confirmed by the performance of 1 μm gate-length transistors. The scaling of AlN barrier thickness from 1.5 nm to 4.5 nm could modify the drain-source saturation current, for zero gate-source voltage, from zero (normally off condition) to 0.63 A/mm. The maximum drain-source current was 1.1 A/mm for AlN barrier thickness of 3.0 nm and 3.7 nm, and the maximum extrinsic transconductance was 320 mS/mm for 3.0 nm AlN barrier.

A mechanism for compositional modulations in InxAl1−xN films is described which considers growth kinetics during molecular beam epitaxy. InAlN crystalline films with various indium contents, grown on GaN or AlN buffer layers to create a variation in lattice mismatch conditions, were studied by transmission electron microscopy. Films comprise of columnar domains which are observed regardless of mismatch, with increasing indium concentration toward domain edges. We propose that indium is incorporated preferentially between adjacent dynamical InAlN platelets, owing to tensile strain generated upon platelet coalescence. The resulting In-rich boundaries are potential minima for further indium adatoms, creating a permanent indium composition gradient.

InxAl1−xN films were heteroepitaxially grown on AlN∕Al2O3 (0001) templates by molecular beam epitaxy. The compositions studied spanned the whole ternary range. The complex dielectric function of the films was investigated by variable angle spectroscopic ellipsometry in the energy range from 0.55to6eV. The energy bandgap bowing parameter was found to strongly depend on composition, monotonically increasing with decreasing InN mole fraction. This behavior is in agreement with theoretical predictions of large charge transfer contributions to bandgap bowing.

The variation in surface electronic properties of undoped c-plane InxAl1−xN alloys has been investigated across the composition range using a combination of high-resolution x-ray photoemission spectroscopy and single-field Hall effect measurements. For the In-rich alloys, electron accumulation layers, accompanied by a downward band bending, are present at the surface, with a decrease to approximately flatband conditions with increasing Al composition. However, for the Al-rich alloys, the undoped samples were found to be insulating with approximate midgap pinning of the surface Fermi level observed.

We present a systematic study, using high resolution x-ray diffraction, of the in-plane a and out-of-plane c lattice parameters of high quality InN films grown by molecular beam epitaxy on GaN∕Al2O3 (0001) substrates. It is found that their values are dependent on the nucleation and growth conditions. Films nucleated in a two- or three-dimensional growth mode exhibit biaxial compressive or tensile strain, respectively. The linear dependence of c on a is consistent with biaxial strain being present in the films. A biaxial strain relaxation coefficient of 0.43±0.04 is deduced. The values of the lattice constants for the case of strain-free InN are estimated to be in the ranges c=5.699±0.004A and a=3.535±0.005A.