1. Advanced germanium layer transfer for ultra thin body on insulator structure
- Author
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Hiroyuki Hattori, Toshifumi Irisawa, Wen-Hsin Chang, Tatsuro Maeda, Hiroyuki Ishii, Hideki Takagi, Noriyuki Uchida, Vladimir Poborchii, and Y. Kurashima
- Subjects
010302 applied physics ,Ultra thin body ,Materials science ,Physics and Astronomy (miscellaneous) ,business.industry ,chemistry.chemical_element ,Germanium ,Insulator (electricity) ,02 engineering and technology ,021001 nanoscience & nanotechnology ,01 natural sciences ,Quantum size effect ,symbols.namesake ,chemistry ,0103 physical sciences ,symbols ,Optoelectronics ,0210 nano-technology ,business ,Raman spectroscopy - Abstract
We present the HEtero-Layer Lift-Off (HELLO) technique to obtain ultra thin body (UTB) Ge on insulator (GeOI) substrates. The transferred ultra thin Ge layers are characterized by the Raman spectroscopy measurements down to the thickness of ∼1 nm, observing a strong Raman intensity enhancement for high quality GeOI structure in ultra thin regime due to quantum size effect. This advanced Ge layer transfer technique enabled us to demonstrate UTB-GeOI nMOSFETs with the body thickness of only 4 nm.
- Published
- 2016
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