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Manganese (Mn)-doped silicon nanocrystals (Si NCs) in which Mn is in its most likely substitutional or interstitial location have been investigated. Large differences in magnetic moment are found between Si NCs doped with substitutional Mn and those doped with interstitial Mn. For all the doped Si NCs, quantum confinement affects the electronic states of majority spin more significantly than those of minority spin. As the NC size changes from 1.2 to 1.5 nm, the spin flipping of electronic transition across the NC optical gap occurs for Si NCs doped with substitutional Mn. This leads to significant changes in the optical absorption of Si NCs. It is likely that such spin-flipping also happens for larger (>1.7 nm) Si NCs doped with interstitial Mn. [ABSTRACT FROM AUTHOR]

The widespread use of 4H silicon carbide (4H-SiC) is just around the corner since high-power electronics based on 4H-SiC are increasingly fabricated to enable the low-carbon development of the world. Quantum technologies are also intensively explored by scrutinizing 4H-SiC as a platform for wafer-scale integration of semiconductor and quantum technologies. Given the importance of impurities and defects for any semiconductor, comprehensive and insightful understanding of impurities and defects in 4H-SiC is imperative. In this Perspective, we summarize recent experimental and theoretical advances in researches on impurities and defects in 4H-SiC after briefly reviewing the history of 4H-SiC. Impurity engineering and defect engineering for the realization of the full potential of 4H-SiC are also discussed. Challenges for the study on impurities and defects in 4H-SiC are finally outlined. [ABSTRACT FROM AUTHOR]

The role of dopants on deformation and mechanical properties of 4H silicon carbide (4H-SiC) is proposed by using nanoindentation. It is found that the hardness, elastic modulus, and fracture toughness of 4H-SiC substrate wafers all decrease on the order of vanadium (V) doping, undoping, and nitrogen (N) doping. For all three types of 4H-SiC, basal plane dislocations (BPDs), threading edge dislocations, and cracks are formed during the nanoindentation. Polymorph transitions from 4H-SiC to amorphous SiC and 3C-SiC are found as the penetration depth of the indent increases from the subsurface to the deeper region. N doping is found to weaken the bond strength of 4H-SiC, which enhances the glide and piling up of BPDs in nanoindentated N-doped 4H-SiC. In contrast, V doping effectively hinders the glide of BPDs, which accumulates a high-stress field and facilitates the polymorph transition from 4H-SiC to 3C-SiC and amorphous SiC. The insight on the effects of dopants on the deformation and mechanical properties of 4H-SiC may help the design of the processing of differently doped 4H-SiC substrate wafers. [ABSTRACT FROM AUTHOR]