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In the conventional carbon nanotube backlight units (CNT-BLUs), light passes through the phosphor-coated anode glass plate, which thus faces closely the thin film transistor (TFT) backplate of a liquid crystal display panel. This configuration makes heat dissipation structurally difficult because light emission and heat generation occur simultaneously at the anode. We propose a novel configuration of a CNT-BLU where the cathode rather than the anode faces the TFT backplate by turning it upside down. In this design, light passes through the transparent cathode glass plate while heating occurs at the anode. We demonstrated a novel design of CNT-BLU by fabricating transparent single-walled CNT field emitters on the cathode and by coating a reflecting metal layer on the anode. This study hopefully provides a clue to solve the anode-heating problem which would be inevitably confronted for high-luminance and large-area CNT-BLUs.

To overcome the limitation of the sputtered Cu seed layer in electroplating of Cu interconnects imposed by the shadow effect, a new method for depositing a Cu seed layer on a 41 nm trench pattern based on combination of electroless plating (ELP) and electron-beam (E-Beam) evaporation was developed. A Cu seed layer formed by ELP alone was too thin to be used for electroplating due to its high resistivity. To solve this problem, an additional Cu layer was deposited on top of the trench by E-Beam evaporator to enhance the electrical conductivity of the Cu seed layer. The electrical resistivity of the resulting Cu layer was reduced to 4.8 μΩ cm, which was sufficient for the conductive seed layer for electroplating the 41 nm trench pattern. The gap-filling capability also improved and there were no voids or seams in the 41 nm trench pattern. The proposed method can be an effective solution for fabrication of a conductive seed layer to fill a 41 nm trench pattern by electroplating.

We successfully fabricated field emitter arrays of carbon nanotube (CNT) dots of 10 μm diameter with excellent field emission properties by using photosensitive CNT paste. The CNT paste was investigated in terms of morphologies, current–voltage properties, and luminous uniformities by varying the mixing ratios of micro and nanoparticle inorganic fillers and the amount of CNTs added into the paste. The 3:1 mixing of micro and nanoparticle fillers and the addition of 5% CNTs in the paste brought about the best field emission characteristics of dot-patterned CNT field emitter arrays.