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The conductive adhesives were made using Ag-coated Cu and V 2 CT x + Ag + MWCNTs + Ag composites as fillers. The effects of V 2 CT x + Ag + MWCNTs + Ag composites content on the conductivity and microstructural properties of the conductive adhesives were investigated using two-point resistance measurements, scanning electron microscopy and XRD, respectively. The results showed that when the Ag package Cu content was 70%, the resistivity increased inversely with the V 2 CT x + Ag + MWCNTs + Ag (0.3%∼0.6%) content. Two-dimensional V 2 CT x + Ag + MWCNTs + Ag composites were obtained by solution mixing, offering the possibility to build up a large number of conductive networks. The synergistic effect of the Ag-claded Cu and V 2 CT x + Ag + MWCNTs + Ag composites significantly reduces the percolation threshold and conductivity of the conductive glue. In particular, the resistivity of the conductive glue is only 3.52 × 10−6 Ω m at a content of 70% Ag-coated Cu and 0.3% V 2 CT x + Ag + MWCNTs + Ag composites. Inside the epoxy resin Ag-coated Cu is connected to each other to form a conductive pathway and V 2 CT x + Ag + MWCNTs + Ag composites is interspersed between the conductive pathways to form a conductive network for electron transport. The synergistic effect of the Ag-coated Cu and V 2 CT x + Ag + MWCNTs + Ag composites makes the epoxy resin conductive adhesive with good conductive properties. [ABSTRACT FROM AUTHOR]