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Bidentate diamine and amino‐alcohol ligands have been used to form solid, water‐soluble, and air‐stable monomeric copper complexes of the type [Cu(NH2CH2CH(R)Y)2(NO3)2] (1, R=H, Y=NH2; 2, R=H, Y=OH; 3, R=Me, Y=OH). The complexes were characterized by elemental analysis, mass spectrometry, infrared spectroscopy, thermal gravimetric analysis, and single‐crystal X‐ray diffraction. Irrespective of their decomposition temperature, precursors 1–3 yield highly conductive copper features [1.5×10−6 Ω m (±5×10−7 Ω m)] upon atmospheric‐pressure plasma‐enhanced sintering. Hot off the press: Bidentate diamine and amino‐alcohol ligands are used to form solid, water‐soluble, and air‐stable monomeric copper complexes. Irrespective of their decomposition temperature, the precursors each yield highly conductive copper features upon atmospheric‐pressure plasma‐enhanced sintering. [ABSTRACT FROM AUTHOR]

A conventional solution-based route to a cyclic trimeric organozinc compound [{Zn(Et)( β-diketonate)}3] ( β-diketonate=OC(OMe)CHC(Me)O, 1) is described, with 1 structurally characterized for the first time. The ligand selection of bidentate β-diketonates is shown to be key to isolating a cyclic trimer. Additional reaction of β-diketonates with diethyl zinc were spectroscopically characterized as compounds of the type [{Zn(Et)( β-diketonate)} n] ( β-diketonate=OC(Me)CHC(Me)O, 2, OC(O tBu)CHC(Me)O, 3). Further studies have shown that selective oxidation of these species produces cubanes of the general formula [{Zn(OC(R)CHC(Me)O)2Zn(Et)OEt}2] (R=OMe, 4; Me, 5; O tBu, 6), allowing a high oxygen content whilst remaining structurally suitable for use as precursors. The successful deposition of thin films of zinc oxide through aerosol-assisted chemical vapor deposition (AACVD), using a novel precursor, is described and fully characterized. [ABSTRACT FROM AUTHOR]

The Cover Feature shows bidentate diamine and amino‐alcohol ligands, which are used to form solid, water‐soluble, and air‐stable monomeric copper complexes for low‐temperature plasma‐assisted inkjet printing of conductive copper. More information can be found in the Full Paper by C. E. Knapp et al. on page 850 in Issue 11, 2018 (DOI: 10.1002/open.201800131). [ABSTRACT FROM AUTHOR]