Search

This paper studies the structural evolution of (AgCo)201 clusters with different Co concentrations under various temperature conditions by using molecular dynamics with the embedded atom method. The most stable position for Co atoms in the cluster is the subsurface layer at low temperature (lower than 200 K for the Ag200Co1 cluster). The position changes to the core layer with the increase of temperature, but there is an energy barrier in the middle layer. This makes the Ag–Co cluster form an Ag–Co–Ag three-shell onion-like configuration. When the temperature is high enough [higher than 800 K for (AgCo)201 clusters with 50% Co], Co atoms can obtain enough energy to overcome the energy barrier and the cluster forms an Ag–Co core-shell configuration. Amorphization for the onion-like and core-shell clusters is induced by the large lattice misfit at Ag–Co interfaces. The structural evolution in the Ag–Co cluster is related to the release of excess energy.

We present an accurate through silicon via (TSV) thermal mechanical stress analytical model which is verified by using finite element method (FEM). The results show only a very small error. By using the proposed analytical model, we also study the impacts of the TSV radius size, the thickness, the material of Cu diffusion barrier, and liner on the stress. It is found that the liner can absorb the stress effectively induced by coefficient of thermal expansion mismatch. The stress decreases with the increase of liner thickness. Benzocyclobutene (BCB) as a liner material is better than SiO2. However, the Cu diffusion barrier has little effect on the stress. The stress with a smaller TSV has a smaller value. Based on the analytical model, we explore and validate the linear superposition principle of stress tensors and demonstrate the accuracy of this method against detailed FEM simulations. The analytic solutions of stress of two TSVs and three TSVs have high precision against the finite element result.