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Phonon sidebands in the electrolumiescence (EL) spectra of InGaN/GaN multiple quantum well blue light emitting diodes are investigated. S-shaped injection current dependence of the energy spacing (ES) between the zero-phonon and first-order phonon-assisted luminescence lines is observed in a temperature range of 100–150 K. The S-shape is suppressed with increasing temperature from 100 to 150 K, and vanishes at temperature above 200 K. The S-shaped injection dependence of ES at low temperatures could be explained by the three stages of carrier dynamics related to localization states: (i) carrier relaxation from shallow into deep localization states, (ii) band filling of shallow and deep localization states, and (iii) carrier overflow from deep to shallow localization states and to higher energy states. The three stages show strong temperature dependence. It is proposed that the fast change of the carrier lifetime with temperature is responsible for the suppression of S-shaped feature. The proposed mechanisms reveal carrier recombination dynamics in the EL of InGaN/GaN MQWs at various injection current densities and temperatures. [ABSTRACT FROM AUTHOR]

Effect of hydrogen (H2) treatment during the GaN barrier growth on the electroluminescence performance of green InGaN/GaN single-quantum-well light-emitting diodes (LEDs) grown on Si substrates is experimentally investigated. We prepare two LED samples with different carrier gas compositions during the growth of GaN barrier. In the H2free LED, the GaN barrier is grown in full nitrogen (N2) atmosphere. For the other H2treated LED, a mixture of N2and H2was used as the carrier gas. It is observed that V-shaped pits decrease in size after H2treatment by means of the scanning electron microscope. Due to the fact that the p–n junction interface would be closer to the p-GaN as a result of smaller V-shaped pits, the tunneling barrier for holes to inject into the InGaN quantum well would become thicker after H2treatment. Hence, the external quantum efficiency of the H2treated LED is lower compared to the H2free LED. However, LEDs would exhibit a better leakage behavior after H2treatment during the GaN barrier growth because of more effective blocking of the threading dislocations as a result of the H2etching at V-shaped pits. [ABSTRACT FROM AUTHOR]