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Green computing is an important factor to ensure the eco-friendly use of computers and their resources. Electric power used in a computer converts into heat and thus, the system takes fewer watts ensuring less cooling. This lower energy consumption allows to be less costly to run as well as reduces the environmental impact of powering the computer. One of the most challenging problems for the modern green supercomputers is the reduction of current power consumptions. Consequently, regular conventional interconnection networks also show poor cost performance. On the other hand, hierarchical interconnection networks (like-3D-TTN) can be a possible solution to those issues. The main focus for this paper is the estimation of power usage at the on-chip level for 3D-TTN with the various other networks along with the analysis of static network performance. In our analysis, 3D-TTN requires about 32.48% less router power usage at the on-chip level and can also achieve near about 21% better diameter performance as well as 12% better average distance performance than the 5D-Torus network. Similarly, it also requires only about 14.43% higher router power usage; however, can achieve 23.21% better diameter performance and 26.3% better average distance than recent hierarchical interconnection network- 3D-TESH. The most attractive feature of this paper is the static hop distance parameter and per watt analysis (power-performance). According to our power-performance results, 3D-TTN can also show better result than the 3D-Mesh, 2D-Mesh, 2D-Torus and 3D-TESH network even at the lowest network level. Moreover, this paper is also featured with the static effectiveness analysis, which ensures cost and time efficiency of 3D-TTN. [ABSTRACT FROM AUTHOR]