1. Absorption-diffusion integrated stacked metamaterials by multi-compound strategy for broadband electromagnetic attenuation.
- Author
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Shi, Yupeng, Duan, Yuping, Huang, Lingxi, Chen, Wei, Liu, Jiangyong, Wang, Meng, and Xia, Chenyang
- Subjects
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MICROWAVE attenuation , *MICROWAVE scattering , *ANGULAR momentum (Mechanics) , *IRON powder , *METAMATERIALS , *WAVE energy , *SURFACE coatings - Abstract
The meta-structural design of flat absorbers demonstrates significant potential for improving microwave attenuation performance. However, the single mechanism of amplitude attenuation through resonance-enhanced effect necessitates considerable material thickness, restricting its application in electromagnetic (EM) defense. Utilizing the synergistic effect of multiple mechanisms is expected to break through the performance limits of microwave stealth metamaterials at the sub-wavelength scale. Herein, absorption-diffusion integration stacked metamaterials (ADISM) were designed using a multi-compound strategy, which comprises bionic porous spherical carbonyl iron powder (SCIP) coatings and stacked vortex metasurfaces (VMs). Such a metamaterial integrates EM scattering modulation with microwave absorption, enabling the creation of a broadband, high-efficiency, low-reflection design, providing an effective absorption bandwidth (EAB) reaching 10.42 GHz (7.58–18 GHz) at a thickness of 2.48 mm. Manipulating the orbital angular momentum (OAM) to effect wavefront transformation, the dissipation of EM wave energy is achieved. The absorption peak frequency modulation and absorption bandwidth broadening are achieved by the intrinsic loss capability of the porous coating, and corresponding mechanisms are demonstrated by simulation models. In short, the synergistic effects of microwave absorption and scattering modulation significantly enhance the return loss capability and facilitate broadband microwave attenuation. This research offers new insights into the multifunctional integration of EM stealth metamaterials. [Display omitted] [ABSTRACT FROM AUTHOR]
- Published
- 2024
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