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For new-generation miniaturized and high-frequency electronics, it is of vital importance to develop advanced electronic packaging materials, which combine high electromagnetic interference (EMI) shielding effectiveness (SE) and efficient thermal management capabilities, including heat absorption, thermal conductivity (TC) and heat dissipation. However, high EMI SE and efficient thermal management usually cannot complement each other for the same packaging material, because EMI shielding devices convert electromagnetic radiation directly into heat consumption, leading to consequent severe challenge to dispose heat dissipation. Herein, we have newly developed a high-performance phase change composites, in which MXene is confined in shape-stabilized phase change material (PCM) for simultaneous achievement of high EMI SE and efficient thermal management. Regarding high EMI, MXene can effectively shield electromagnetic radiation by converting the radiation into heat consumption. As for thermal management, PCM enables efficient heat absorption via the phase change process, and MXene enhances the thermal conductivity (TC) of MXene/PCM composite to facilitate heat dissipation. As a result, our developed MXene/PCM composite can achieve a high EMI SE of 64.7 dB in X-band, with an improved TC of 0.74 W/m·K. Furthermore, the interlayer capillary effect of MXene inhibits the leakage of liquid PCM during the solid-liquid phase transition, which can maintain the PCM shape stability. Our newly-designed shape-stabilized MXene/PCM composites with high EMI SE and large TC shed new light on designing EMI shielding materials with prolonged exposure to electromagnetic radiation, which can be envisioned to exhibit vast implications for advanced new-generation miniaturized and high-frequency electronics. [Display omitted] [ABSTRACT FROM AUTHOR]