1. Hybrid integration for low-cost OE packaging and PLC transceiver
- Author
-
M.A. Capuzzo, E.J. Laskowski, L.T. Gomez, D.J. Muehlner, R. Yang, G.E. Henein, J.V. Gates, and Joseph Shmulovich
- Subjects
Reduction (complexity) ,business.industry ,Computer science ,Embedded system ,Optical cross-connect ,Transmitter ,Volume (computing) ,Integrated circuit packaging ,Transceiver ,Optical performance monitoring ,business ,Optical switch ,Computer hardware - Abstract
We will describe in this paper a technology to integrate all the optical functions on one single piecepart, the planar lightguide circuit (PLC), departing from the traditional approach of separately packaged transmitter (Tx) and receiver (Rx). The rationale is that the increase in complexity/cost incurred at wafer-scale processing is, in large volume (>100k/yr), greatly outweighed by the reduction in the final number of pieceparts/assembly cost, resulting in a net lowering of the overall cost of the optical network unit.
- Published
- 2002