1. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing
- Author
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Wei Junjun, Jue Wang, Haitao Ye, Tomasz J. Ochalski, T. Knott, Chen Liangxian, Yuting Zheng, Liu Jinlong, Aude Cumont, Rob Thornton, Chengming Li, and Ruoying Zhang
- Subjects
Materials science ,Single crystal diamond ,Mechanical Engineering ,Diamond ,Polishing ,Cleavage (crystal) ,02 engineering and technology ,General Chemistry ,Surface finish ,engineering.material ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,Polycrystalline diamond ,0104 chemical sciences ,Electronic, Optical and Magnetic Materials ,Materials Chemistry ,engineering ,Dynamical friction ,Crystallite ,Electrical and Electronic Engineering ,Composite material ,0210 nano-technology - Abstract
To unfold the promise of diamond as an advanced technical material, single-crystal diamonds (SCDs) and polycrystalline diamonds (PCDs) were smoothed by high-precision three-dimensional movement dynamic friction polishing (3DM-DFP) to achieve the ultra-smooth surface with roughness
- Published
- 2020
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