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An interesting device design including a zirconium oxide (ZrO2) current blocking layer (CBL) and a ZrO2 surface passivation layer (SPL) is employed to manufacture a GaN/InGaN light-emitting diode (LED). Based on the inherently good performance of ZrO2, the current spreading effect and the undesired surface leakage are efficiently enhanced and suppressed, respectively. Energy-dispersive X-ray spectroscopy (EDS), atomic force microscopy (AFM), scanning electron microscopy (SEM), and transmission electron microscopy (TEM) are used to study the relevant properties. It is found that by series calibration, 50 nm is the proper thickness of the ZrO2 CBL and SPL. The peak emission wavelength of the proposed LEDs is around 452 nm. Experimentally, at the operating condition of 110 A cm−2, the proposed Device L3 with a 50 nm-thick ZrO2 CBL and a 50 nm-thick ZrO2 SPL demonstrates improvements of 66.1% in light output power (LOP) and 64.5% in wall plug efficiency (WPE) as compared to a traditional Device L1 without the specific design. Furthermore, the proposed Device L3 presents a notable enhancement in the light emission mapping image in comparison to the traditional LED. So, the proposed device design which incorporates a proper ZrO2 CBL and ZrO2 SPL, is beneficial for manufacturing GaN/InGaN LEDs.

An Al2O3 thin film is deposited on the interdigitated electrodes to fabricate a resistive hydrogen sensor. In addition, the Pd nanoparticles (NPs)/Pd film by vacuum thermal evaporation system on the Al2O3 film acts as catalytic metals for hydrogen detection. Due to the Pd NPs with an increased surface area to volume ratio as well as the spill-over effect, the catalytic activity could be improved to enhance the gas sensing performance. The experimental results showed that the sensing response ratio is 14.4% in 1000 ppm H2/air at 300 °C, which is suitable for high-temperature hydrogen detection. The studied Pd NPs/Pd/Al2O3 resistive sensor exhibits the advantages of in high-temperature operation, simple structure, easy fabrication process, and relatively low cost.

In this article, Al0.28Ga0.72N/AlN/GaN metal-oxide-semiconductor high electron mobility transistors (MOS-HEMTs) with Ni/Au gate metal electrode are demonstrated. NiO or Al2O3 gate oxide layer is employed as a gate dielectric layer effectively decreases the gate leakage current, enhances drain current density, and transconductance, simultaneously. As compared with the metal-semiconductor (MS) Schottky-gate device, excellent characteristics are achieved for the MOS-HEMT with NiO (Al2O3) gate oxide layer, which include maximum drain-to-source saturation current density of 626.5 (692.0) mA/mm, maximum transconductance of 87.6 (94.2) mS/mm, gate-to-drain leakage current of 1.47  10-7 (8.21  10-11) mA/mm, threshold voltage of -3.48 (-3.45) V, gate voltage swing of 2.88 (3.08) V, respectively. Experimentally, the MOS-HEMT with an Al2O3 gate oxide layer shows good potential for signal amplification and circuit applications.