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It has been recognized for a long time that both peak temperature and time at temperature are important in RTP processes such as spike anneals. This paper will discuss the importance of time at temperature during flash assist rapid thermal processing (fRTP{trade mark, serif}). Experimentally measured temperature profiles are analyzed assuming simple activation energies to optimize temperature profiles. The relative importance of peak temperature and temperature profile is discussed for electrical activation and diffusion of a 500 eV 1015/cm2 B implant. Considerations of thermal stress produced during processing are included in the optimization process. When all effects are considered, different thermal processes will require tools with very flexible process capabilities. It is shown that both the peak temperatures as well as the temperature profile near the peak are important.