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1. Wafer-Level High-Power Device Testing.

Author

Lecklider, Tom

Subjects
*ELECTRIC currents, *SEMICONDUCTORS, *ELECTRONICS, *ELECTRIC conductivity, *ELECTRONIC circuits
Abstract

The article addresses the provision and dissipation of power and electric current in wafer testing. It discusses improvements to the way power is supplied based on papers at the SouthWest Test Workshop. It describes a vertical probe card with added SmartClamp overcurrent protection. It analyzes the power supply-to-device under test electrical current path.

Published
2006