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1. Chips stacked for through-silicon vias.

Author

LaPedus, Mark

Subjects
*INTEGRATED circuit interconnections, *INTEGRATED circuits, *CONFERENCES & conventions
Abstract

The article cites that Georgia Tech University, IBM Corp., IMEC, the Fraunhofer Institute, Tohoku University and TSMC presented papers on through-silicon via technology (TSV) at the Institute of Electrical and Electronics Engineers Inc. 2008 International Interconnect Technology Conference in Burlingame, California. TSV technology is seen as a solution to a looming interconnect crisis which could emerge by 2009.

Published
2008