Search

The article discusses the papers presented at the International Solid-State Circuits Conference (ISSCC) held in February 2009 at the San Francisco Marriott hotel in California. One of the papers considers the introduction of Intel Corp.'s Nehalem-EX server CPU, a 2.3 billion-transistor member of its 45-nm Nehalem family. Meanwhile, another paper shows the technique described by Hideaki Saito, a principal researcher at NEC Corp., for stacking a memory chip using direct aluminum-to-copper links.

Reports on the 2204 Design Automation Conference on June 7-11 in San Diego, California. Theme of the conference; Number of accepted papers; Topics for discussion; Keynote speakers; Hands-on tutorials.