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In this paper, the effect of solar intensity on the heat pipe tip temperature in a heat pipe type—evacuated-tube solar collector (HP-ETSC) was investigated. A simple relation was proposed, relating the solar intensity to the heat pipe tip temperature generated from the experimental data. This simple empirical relation was applied in a set of heat transfer equations derived to predict the heating medium temperature at the manifold outlet of the evacuated-tube solar collector. The calculated results corresponding to two types of heating medium, i.e., palm oil and water, were compared with experimental results from the literature. The results show that the average error was 6.41% for the case of palm oil and 4.66% for the case of water. Based on the case of water as a heating medium fluid, it was found that the flow rate of the heating medium fluid affected the accuracy of prediction, as the percentage error increased with the heating medium flow rate. The maximum percentage error increased from only 1.83% for a water inlet flowing at a Reynolds number of about 2.4 × 103 to 15.23% for a water flow rate at a Reynolds number of about 2.6 × 104. The correction factor was added into the correlation to predict the heat transfer coefficients of heating medium fluids. With this correction factor, the maximum error could be reduced from 11.78% to 7.29% for the palm oil case and from 15.23% to 5.57% for the water case. The average errors corresponding to palm oil and water cases could be reduced to 0.74% and 1.26%, respectively. [ABSTRACT FROM AUTHOR]

The cooling system is the auxiliary equipment that consumes the most energy in a data center, accounting for about 30 to 50% of the total energy consumption. In order to effectively reduce the energy consumption of a data center, it is very important to improve the heat exchange efficiency at the chip level. Compared with air cooling, single-phase cold plate liquid cooling, and immersion liquid cooling, the flat loop heat pipe (FLHP) is considered to be a better chip-level cooling solution for data centers. It has extremely high heat transfer efficiency and heat flux variability, and it can avoid the operation risk caused by liquid entering the server. In this paper, a FLHP with an evaporator designed with a "Tesla valve" flow channel configuration is developed. Experiments on the FLHP are carried out, focusing on the installation angles and cooling condition factors. The results show that an inclination angle of 20° is the critical point of the influence of gravity on the performance of the FLHP; to ensure good operation of the FLHP, the installation angle should be greater than 20°. The equivalent heat transfer coefficients of the FLHP condenser under different cooling conditions are calculated. It is found that water cooling can provide higher cooling heat transfer coefficients with lower energy consumption and operating noise. Additionally, the heat transfer limit, operating temperature uniformity, and start-up stability of the FLHP are significantly improved under water cooling conditions. The maximum heat load of the FLHP is up to 230 W, and the temperature difference of the evaporator surface can be controlled within 0.5 °C, under 20 °C water cooling. Finally, using the FLHP for thermal management of the chip, its heat transfer efficiency is 166 and 41% higher than that of air cooling and water cooling, respectively. [ABSTRACT FROM AUTHOR]

Therefore, heat transfer during flow with a change of phase in mini-channels turned out to be a necessary solution to achieve high heat fluxes with reasonably miniature geometrical dimensions and a temperature at a not very high level within the heat exchanger device. The authors noted that there was an increase in the heat flux and the heat transfer coefficient for surfaces with microchannels. The transfer of large heat fluxes is one of the most significant issues in modern technology. The authors indicated that the construction of a compact heat exchanger with a group of rectangular mini- and microchannels with enhanced surfaces can improve the heat transfer process. [Extracted from the article]