1. Strain-rate dependent influence of adherend stiffness on fracture load prediction of BGA solder joints
- Author
-
Amir Nourani, Jan K. Spelt, Gholam Hossein Farrahi, and Saeed Akbari
- Subjects
Materials science ,Strain (chemistry) ,business.industry ,Mechanical Engineering ,Stiffness ,02 engineering and technology ,Bending ,Structural engineering ,Strain rate ,021001 nanoscience & nanotechnology ,Cohesive zone model ,020303 mechanical engineering & transports ,0203 mechanical engineering ,Mechanics of Materials ,Ball grid array ,Soldering ,Fracture (geology) ,medicine ,General Materials Science ,Composite material ,medicine.symptom ,0210 nano-technology ,business - Abstract
Fracture experiments with ball grid array (BGA) specimens having different adherend rigidities were performed under bending loads at intermediate strain rates (0.2–1 s−1) and a high strain rate of 30 s−1. A cohesive zone model (CZM) was established and the predictive capability of the model was assessed for the specimens with different rigidities. The predicted fracture loads were within 12% of the measured forces when the CZM parameters were obtained using specimens with a similar degree of constraint. This suggests that in many practical cases, the effect of adherend stiffness can be neglected in predicting the strength of BGA solder joints.
- Published
- 2017