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Home appliance manufacturers have recently been trying to provide smart products capable of various Internet services. For example, one health care manufacturer provides a Wi-Fi-capable scale. Once users register their information with the manufacturer's server, their weight and body fat records are automatically uploaded to the server whenever they measure their weight. The users can then watch and check their weight log easily using a smart device, such as a smartphone or tablet. One of the biggest problems, however, is that the initial configuration of the appliances and the user registration process may be quite complicated to typical users who are unfamiliar with such IT devices. This paper proposes an autoconfiguration system structure and protocol for Internet-capable home appliances, which supports the initial configuration and remote maintenance service of the device with only little user effort. Manufacturers can develop their own information appliances and provide differentiated services using the proposed system and protocol.

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energydispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.