1. Spatial defect pattern recognition on semiconductor wafers using model-based clustering and Bayesian inference
- Author
-
Yuan, Tao and Kuo, Way
- Subjects
Algorithms -- Models ,Semiconductor wafers -- Models ,Circuit components -- Models ,Semiconductor industry -- Production processes ,Semiconductor industry -- Models ,Algorithm ,Semiconductor device ,Semiconductor industry ,Business ,Business, general ,Business, international - Abstract
To link to full-text access for this article, visit this link: http://dx.doi.org/10.1016/j.ejor.2007.06.007 Byline: Tao Yuan (a), Way Kuo (b) Keywords: Quality control; Stochastic processes; Pattern recognition; Semiconductor manufacturing Abstract: Defects on semiconductor wafers tend to cluster and the spatial defect patterns contain useful information about potential problems in the manufacturing process. This study proposes to use model-based clustering algorithms via Bayesian inferences for spatial defect pattern recognition on semiconductor wafers. These new algorithms can find the number of defect clusters as well as identify the pattern of each cluster automatically. They are capable of detecting curvilinear patterns, ellipsoidal patterns and nonuniform global defect patterns. Promising results have been obtained from simulation studies. Author Affiliation: (a) Department of Industrial and Information Engineering, The University of Tennessee, Knoxville, TN 37996, United States (b) College of Engineering, The University of Tennessee, 124 Perkins Hall, Knoxville, TN 37996, United States Article History: Received 24 August 2006; Accepted 3 June 2007
- Published
- 2008