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Arrcus has collaborated with VMware to expand their network and compute virtualization solution. This collaboration will create geo-redundant Distributed Data Centers capable of handling diverse workloads and applications. The ACE platform facilitates the creation of distributed data center fabrics, while VMware NSX allows for the virtualization of the physical network. This integration provides customers with the ability to build data center networks for different workloads using open standards-based design and programming interfaces. Arrcus is committed to open networks and offers a wide range of energy-conserving merchant silicon and hardware options. [Extracted from the article]

OVHcloud US has introduced new dedicated Bare Metal Advance servers powered by the latest AMD EPYC 4004 Series processors. These third-generation servers offer high performance and a competitive price ratio, making them suitable for a range of customers, including SMB organizations. The servers utilize AMD's "Zen 4" micro-architecture and are available in various configurations for different use cases. OVHcloud's ADV-Gen3 servers also benefit from a high-performance private network and data protection measures. The servers will initially be available in select data centers, with global availability expected in the future. [Extracted from the article]

Intel Corporation has made a significant breakthrough in integrated photonics technology for high-speed data transmission. At the Optical Fiber Communication Conference (OFC) 2024, Intel's Integrated Photonics Solutions (IPS) Group showcased the industry's first fully integrated optical compute interconnect (OCI) chiplet, which is co-packaged with an Intel CPU and can transmit live data. This OCI chiplet supports 64 channels of 32 Gbps data transmission in each direction on up to 100 meters of fiber optics, addressing the increasing demands of AI infrastructure for higher bandwidth, lower power consumption, and longer reach. The chiplet utilizes silicon photonics technology and can be integrated with various CPUs, GPUs, IPUs, and SoCs. Intel's leadership in silicon photonics is based on over 25 years of research and development, and the company has shipped millions of silicon photonics-based connectivity products with high reliability to major cloud service providers. [Extracted from the article]

SMART Modular Technologies, Inc. has introduced Zefr ZDIMM memory modules, which are highly reliable and suitable for data centers, hyperscalers, and high-performance computing platforms. These modules are designed for large memory applications that require maximum availability. ZDIMM modules come in DDR4-3200 and DDR5-5600 form factors and undergo a screening process that ensures their robustness and resilience in demanding computing scenarios. Compared to industry standard memory modules, ZDIMM modules have significantly lower defective parts per million (DPPM), making them valuable in critical data processing environments. SMART Modular Technologies has been providing specialty memory solutions for over 30 years, catering to diverse applications in high-growth markets. [Extracted from the article]

Vertiv has introduced a new range of high-density data center infrastructure solutions called Vertiv 360AI to support the increased power and cooling requirements of AI and HPC. These solutions aim to accelerate AI adoption by providing pre-engineered infrastructure, digitized management, and end-to-end service, resulting in faster deployment. The Vertiv 360AI portfolio offers a streamlined approach to power and cool AI workloads, with flexible cooling strategies and modular solutions that can be customized to meet current and future infrastructure needs. Vertiv is hosting an AI Solutions Innovation Roadshow to showcase these solutions and discuss the impact of AI on data center design. [Extracted from the article]