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In this work, we developed an in situ annealing process to crystallize boron-doped amorphous silicon [a-Si(p+)] layers deposited by atmospheric pressure chemical vapour deposition (APCVD) to form boron-doped polycrystalline silicon [poly-Si(p+)] layers. The influence of the temperature profiles during a-Si(p+) inline deposition on structural, electrical, and passivation properties was studied in detail. The results show that a-Si(p+) layers can be successfully crystallized by fine-tuning the temperature profiles in the postdeposition zones of the APCVD tool. It was observed that the hydrogenation processes during the fast firing play a significant role in enhancing the passivation quality as well as the electrical properties of the in situ annealed poly-Si(p+) layers. The sheet resistance (Rsh) and implied open circuit voltage (iVoc) of the best in situ annealed poly-Si(p+) layers were found to be comparable to the ones that were ex situ annealed in the tube furnace at 950 $^{\circ }$C for 30 min. The sheet resistance of 200 $\Omega$/$\square$ could be obtained on 150-nm thick poly-Si(p+) layers with an (iVoc) of 718 mV. The use of this novel in situ annealing process to form poly-Si(p+) layers opens a new horizon for a lean process sequence without the additional high-temperature annealing step for fabricating solar cells concepts based on passivating contact.

Hydrogenation of polycrystalline silicon (poly-Si) passivating contacts is crucial for maximizing their passivation performance. This work presents the application of Al2O3 prepared by atomic layer deposition as a hydrogenating capping layer. Several important questions related to this application of Al2O3 are addressed by comparing results from Al2O3 single layers, SiNx single layers, and Al2O3/SiNx double layers to different poly-Si types. We investigate the effect of the Al2O3 thickness, the poly-Si thickness, the poly-Si doping type, and the postdeposition annealing treatment on the passivation quality of poly-Si passivating contacts. Especially, the Al2O3/SiNx stack greatly enhances the passivation quality of both n+ and p+ doped as well as intrinsic poly-Si layers. The Al2O3 layer thickness is crucial for the single-layer approach, whereas the Al2O3/SiNx stack is less sensitive to the thickness of the Al2O3 layer. A thicker Al2O3 layer is needed for effectively hydrogenating p+ compared to n+ poly-Si passivating contact. The capping layers can hydrogenate poly-Si layers with thicknesses up to at least 600 nm. The hydrogenation-enhanced passivation for n+ poly-Si is found to be more thermally stable in comparison to p+ poly-Si. These results provide guidelines on the use of Al2O3 capping layers for poly-Si contacts to significantly improve their passivation performance.