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Start Over Author "Berning, David W." Journal ieee transactions on components, packaging & manufacturing technology, part a
1 results on '"Berning, David W."'

1. Issues in validating package compact thermal models for...

Author

Adams, Vance H., Blackburn, David L., Joshi, Yogendra K., and Berning, David W.

Subjects
ELECTRONIC packaging, THERMAL analysis, THERMOPHYSICAL properties
Abstract

Proposes a methodology for the validation of compact thermal models of electronic packages which utilizes data and simulations obtained from a simple but realistic system containing the package. Thermophysical properties used for computations; Heat transfer budgets for thermal models; Compact modeling strategies; Conclusion.

Published
1997
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