1. Study of Techniques for Flip-Chip Bonding to Organic Substrates for Low-Power Applications.
- Author
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Kerachev, Lyubomir, Lembeye, Yves, and Crebier, Jean-Christophe
- Subjects
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FLIP chip technology , *COMPLEMENTARY metal oxide semiconductors , *ELECTRIC inverters , *INTEGRATED circuits , *ELECTRONIC packaging , *ELECTRIC inductance - Abstract
This paper deals with the study of technologies for flip-chip assembly of CMOS integrated power converters on standard FR4 organic substrates. Tests for the characterization of commercially available technologies for microassemblies, such as anisotropic adhesive bonding, thermocompression bonding, thermosonic/ultrasonic bonding, and solder bonding, are carried out. The aim of this paper is to determine the most suitable flip-chip bonding technology for power CMOS circuits with more than 50 pads. First, the coupled design of the CMOS chip and the corresponding substrate dedicated to low-power microconversion (10 W) is presented. It is shown that the parasitic resistances and inductances of the interconnections increase the conduction and switching losses of the device. This leads to a temperature rise, which can limit the operating ratings of the circuit. The experimental results are provided to evaluate each technology for flip-chip assembly. [ABSTRACT FROM PUBLISHER]
- Published
- 2015
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