1. Package Inductors for Intel Fully Integrated Voltage Regulators.
- Author
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Lambert, William J., Hill, Michael J., Radhakrishnan, Kaladhar, Wojewoda, Leigh, and Augustine, Anne E.
- Subjects
- *
VOLTAGE regulators , *FLIP chip technology , *ELECTRIC controllers , *ELECTRONIC packaging , *VOLTAGE control - Abstract
Intel fourth-generation and fifth-generation Core microprocessors are powered by high-frequency integrated switching voltage regulators. The inductors required to implement these regulators are constructed using the routing layers of conventional organic flip chip packaging. This paper provides an overview of the construction of these inductors including representative results from production packages. Measured inductors reported in this paper span from 1 to 6.7 nH under 2.4 mm2 and achieve $Q$ of up to 24 at 140 MHz (the switching frequency). [ABSTRACT FROM AUTHOR]
- Published
- 2016
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