1. Molecular Dynamics on Cracking Mechanism of Oil-Pressboard Insulation Under Electric–Thermal Coupling.
- Author
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Zhao, Zhongyu, Wang, Guan, Liu, Hongshun, Yang, Jingjing, Wu, Hongbin, and Li, Qingquan
- Subjects
MOLECULAR dynamics ,ELECTRIC field effects ,TRANSFORMER insulation ,DEGREE of polymerization ,SMALL molecules ,INSULATING oils ,SILICONE rubber - Abstract
Transformer oil and insulation paper are subject to the combined effects of the electric field and temperature operations, which significantly impact insulation deterioration. This article designs a comparative test of the electro-thermal combined aging to obtain several characteristic parameters for the aging degree of oil-pressboard insulation. Molecular dynamics are used to establish a mixed molecular model of oil-pressboard insulation to simulate the pyrolysis reactions at high temperatures using the ReaxFF force field. The microscopic effects of the electric field on the aging of oil-pressboard insulation are studied. The rationale of the simulation model is verified from experimental results, and the trend of the reactants and products in the reaction process was considered to determine the influence mechanism of electric–thermal coupling on oil-pressboard insulation. The experimental results show that thermal stress remains the most important factor toward cracking in insulation paper. The acid value and furfural formation rate in oil increase, and the polymerization degree of the insulation paper decreases rapidly after the combined electric and thermal aging. In addition, the molecular dynamics simulations show that pyrolysis increases the bond energy, promotes repulsion between atoms, and leads to fractured bonds. The addition of the electric field increases the susceptibility of the chemical bonds in cellulose molecules to breakage. The morphology of the cellulose chain then changes, and the diffusion of small molecules intensifies. This study reveals the mechanism of insulation aging under electro-thermal coupling through combined macroscopic testing and molecular dynamics simulations. [ABSTRACT FROM AUTHOR]
- Published
- 2022
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