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Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Flexible, highly sensitive, easy fabricating process, low-cost pressure sensors are the trend for flexible electronic devices. Despite the tremendous progress in recent years, it is still challenging to prepare pressure sensors with high sensitivity, high stability, and fast responsiveness. In this study, we report a simple and low-cost method for the preparation of novel pressure sensors. Inspired by the pomegranate structure, a 3-D porous structure consisting of polystyrene (PS) microspheres filled with reduced graphene oxide (rGO) paper is proposed. This pressure sensor has high linear sensitivity (1.41 kPa−1 in the pressure range of 0–50 kPa), high stability (1000 cycles), and quick response time (~20 ms). Furthermore, a robotic arm interacting control system based on pressure sensor arrays is constructed, which demonstrates the far-reaching potential of pressure sensors in human–machine interaction. Therefore, this work provides a low-cost and effective method for preparing high linear sensitivity pressure sensors. [ABSTRACT FROM AUTHOR]

Over the past 10 years, 3-dimensional (3-D) wafer-level stacked backside Illuminated (BSI) CMOS image sensors (CISs) have undergone rapid progress in development and performance and are now in mass production. This review paper covers the key processes and technology components of 3-D integrated BSI devices, as well as results from early devices fabricated and tested in 2007 and 2008. This article is divided into three main sections. covers wafer-level bonding technology. covers the key wafer fabrication process modules for BSI 3-D wafer-level stacking. presents the device results. [ABSTRACT FROM AUTHOR]

Technology computer-aided design (TCAD) is an integral part of the development process of semiconductor technologies and devices, a field which has become increasingly complex and heterogeneous. Processing of integrated circuits requires nowadays over 400 process steps, and the resulting devices often have an intricate 3-D structure and contain various specifically designed materials. The full device behavior can only be understood by considering effects on all length scales from atomistic (material properties, interfaces, defects, and so on), to nanometric (quantum confinement, non-bulk properties, tunneling, ballistic transport, and so on), to full-chip dimensions (strain, heat transport, and so on), and time scales from femtoseconds (scattering, ferroelectric switching time, and so on) to seconds (trapping times, degradation, and so on). Voltages, currents, and charges have been scaled to such low levels that statistical effects and process variations have a strong impact. Devices based on new materials (e.g., 2-D crystals) and physical principles (ferroelectrics, magnetic materials, qubits, and so on) challenge standard TCAD approaches. While the simulation methods developed by the physics community can describe the basic device behavior, they often lack important simulation capabilities like, for example, transient simulations or integration with other TCAD tools, and are often too slow for daily use. Due to the complexity of semiconductor technology, it becomes more and more difficult to assess the impact of a change in processing or device structure on circuit performance by looking at a single aspect of an isolated device under idealized conditions. Instead, a TCAD tool chain is required which can handle realistic device structures embedded in a chip environment. New methodologies are required for all aspects of TCAD to ensure an efficient tool chain covering from atomistic effects to circuit behavior based on flexible simulation models that can handle new materials, device principles, and the ensuing large-scale simulations and that make use of artificial intelligence for well-chosen (sub)routines to decrease the overall simulation time. This Special Issue features six invited and 18 regular papers that address these problems. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal. [ABSTRACT FROM AUTHOR]

These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal. [ABSTRACT FROM AUTHOR]

Describes the above-named upcoming special issue or section. May include topics to be covered or calls for papers. [ABSTRACT FROM AUTHOR]

These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Describes the above-named upcoming special issue or section. May include topics to be covered or calls for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal. [ABSTRACT FROM AUTHOR]

A year has gone by since the publication, in December 2020, of my last editorial devoted to thanking our reviewers. Another year (hopefully, the last one) where the persisting COVID pandemic has restricted our possibility to interact with people and to operate in a normal environment. I am happy to remark that, despite this, the review process of the papers submitted to the IEEE Transactions on Electron Devices (TED) was again virtually unaffected, even in the presence of an increasing submission count. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal. [ABSTRACT FROM AUTHOR]

The article presents call for papers by the periodical related to solid-state image sensors.