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The introduction of metal nanocrystals (NCs) has been confirmed to improve electrical uniformity of oxide-based resistive random access memory (RRAM) devices significantly; however, the current reports do not systematically elucidate the relationship between the size/distribution of NCs and the electrical uniformity of RRAM devices. In this paper, we focused on the impact of metal NCs size and areal density on the resistive switching (RS) performances of oxide RRAM by atomic layer deposition (ALD) based on the experimental results and theoretical calculation. The dependence of ALD cycles of 50–130 during Pt or CoPtx NCs growth on the RS parameters of Al2O3 or HfO2 memory units has been evaluated systematically. The RRAM embedded Pt or CoPtx NCs shows the trends: with increasing ALD cycles, the forming voltage, set/reset voltage, the resistance in off and on state, and ${R}_{ \mathrm{\scriptscriptstyle OFF}}/{R}_{ \mathrm{\scriptscriptstyle ON}}$ ratio entirely first decrease, then flatten, and increase later with a minimum value at about 100 cycles. Although all metal NCs with various sizes enhance the electric field strength compared to at the planar region, only metal NCs with proper NCs size and areal density (9 nm/6– $10\times 10^{\textsf {11}}$ /cm2 in this paper) can effectively produce stronger localized electric field at the tip of metal NCs, leading to optimal RS behavior. [ABSTRACT FROM AUTHOR]

This paper investigates the issues of oxygen accumulation and variation in the high-resistance state of HfO2-based resistive random access memory (RRAM), with improvement attained by inserting a thin oxygen-vacancy-rich layer of indium-tin-oxide (ITO) film. By acting as the oxygen ion reservoir, this ITO thin film on the TiN electrode can further stabilize resistance switching (RS) characteristics. In terms of reliability, ac endurance, and retention tests confirm stable RS characteristics for the Pt/HfO2/ITO/TiN device. Finally, a conducting model was proposed to explain the influence of the ITO thin layer and clarify the physical mechanism of electrical improvements. [ABSTRACT FROM AUTHOR]

In the study of resistive random access memory using GeTeOx film as the switching layer, the device performed excellent property of bipolar resistive switching (BRS), which could be gradually transformed to the complementary resistive switching (CRS) by varying SET process current compliance. The conductive filament conduction mechanism of BRS could be verified by electrical characteristics and reliable data fitting. Through increasing current compliance of the SET process, CRS could be achieved due to higher activity of oxygen vacancies originated from the intensified thermal effect. This paper was beneficial to understand the switching mechanisms of BRS and CRS and provide a method to realize interconversion. Moreover, it was also a potential and promising device to be applied in the neurosynaptic biomimetic field. [ABSTRACT FROM AUTHOR]

An intentionally introduced interface layer in the resistive random-access memory (RRAM) devices play an important role in the improvement of resistive switching characteristics. In this paper, the resistive switching characteristics of ZrO2-based RRAM devices by inserting a thin TiO2 interface layer between electrodes and ZrO2 resistive switching layer were investigated. Compared with the Cu/ZrO2/Pt and Cu/ZrO2/TiO2/Pt devices, the Cu/TiO2/ZrO2/Pt and Cu/TiO2/ZrO2/TiO2/Pt devices showed much improved programing voltages, including lower forming voltage and lower set voltage. Moreover, the reset current was also improved. These results indicate that the TiO2 interface layer between the anode electrode and the resistive switching layer plays an important role in improving device performance. [ABSTRACT FROM AUTHOR]

In modern electronic devices, a variety of novel materials have been introduced such as transition metal oxides, chalcogenides, ferroelectric, and magnetic materials. The electrical response of such materials, used also as active layers, is strongly affected by atomic defects, which affect device performances, variability, and reliability. Extracting the defect properties (i.e., density, energy, and atomic nature) is, thus, crucial to both engineer the performances of electron devices and correctly project their scaling potential and reliability. In this paper, we propose a simple method to extract the atomic properties of defects from the thermal activation energy of the leakage current using a charge trapping relaxation model. [ABSTRACT FROM AUTHOR]

The switching properties of Te and TeTiW top electrodes (TEs) on TiW/SiN/TiN resistive switching memory devices are explored in this paper. The TeTiW TE device exhibits more favorable bipolar resistive switching behavior because of the decrease in binding energy after its use. This finding is confirmed through X-ray photoelectron spectroscopy analyses. The filament of the TeTiW TE device is metal like after forming, and the reset process corresponds with the thermal-dissolution mechanism. A physical model based on a Te filament is constructed to explain such phenomena. The TeTiW TE device provides the excellent endurance of more than 104 cycles, with an ON/OFF ratio of 500. The improvement can be attributed to the filament’s robustness during the forming and set processes, which prevent its diffusion even at high temperature. The device also features long retention for up to 104 s at 225 °C without stress, and 104 s at 85 °C with stress of −0.3 V. Therefore, it has high potential for high-density nonvolatile memory applications. [ABSTRACT FROM AUTHOR]

The cross-point architecture for memory arrays is widely considered as one of the most attractive solutions for storage and memory circuits thanks to simplicity, scalability, small cell size, and consequently high density and low cost. Cost-scalable vertical 3-D cross-point architectures, in particular, offer the opportunity to challenge Flash memory with comparable density and cost. To develop scalable cross-point arrays, however, select devices with sufficient ON–OFF ratio, current capability, and endurance must be available. This paper presents a select device technology based on volatile resistive switching with Cu and Ag top electrode and silicon oxide (SiOx) switching materials. The select device displays ultrahigh resistance window and good current capability exceeding 2 MAcm−2. Retention study shows a stochastic voltage-dependent ON–OFF transition time in the 10~\mu \texts –1 ms range, which needs to be further optimized for fast memory operation in storage class memory arrays. [ABSTRACT FROM PUBLISHER]

Resistive-switching random access memory (RRAM) is widely considered as a disruptive technology. Despite tremendous efforts in theoretical modeling and physical analysis, details of how the conductive filament (CF) in metal-oxide-based filamentary RRAM devices is modified during normal device operations remain speculative, because direct experimental evidence at defect level has been missing. In this paper, a random-telegraph-signal-based defect-tracking technique (RDT) is developed for probing the location and movements of individual defects and their statistical spatial and energy characteristics in the CF of state-of-the-art hafnium-oxide RRAM devices. For the first time, the critical filament region of the CF is experimentally identified, which is located near, but not at, the bottom electrode with a length of nanometer scale. We demonstrate with the RDT technique that the modification of this key constriction region by defect movements can be observed and correlated with switching operation conditions, providing insight into the resistive switching mechanism. [ABSTRACT FROM PUBLISHER]

In this paper, we present a distinguished hysteresis behavior by a few nanometers inlaid Zr–Hf–O (ZHO) layer between the Ba0.6Sr0.4TiO3(BST) film and the metal Pt electrode. The capacitance–voltage curve shows an insignificant change in the range of 0.3–1 MHz. The excellent retention property showing the difference of high state and low state is estimated as about 23.0% and 12.5% after one year and ten years, which might be caused by the deeper trap in an interdiffusion layer. The possible mechanism is proposed that the BST/ZHO interface exists as an interdiffusion, which could create additional defects and ambipolar charge injection causing the hysteresis behavior due to a postdeposition annealing process. The device can be employed as a promising candidate for applying in novel nonvolatile memory device. [ABSTRACT FROM PUBLISHER]

This paper proposes low power consumption resistance random access memory (RRAM) devices with indium–tin-oxide (ITO) electrodes. The development of the Internet of Things (IoT) is a trend in future technology, but the bottleneck in IoT development is high power consumption; therefore, targeting low-power-consumption memory is crucial for the IoT. ITO-capped RRAM devices have been shown to exhibit outstanding performance and low power consumption, and here, we propose an oxygen accumulation mechanism by analyzing device characteristics. We find that the conduction current mechanism will be affected by oxygen absorbance in the ITO electrode. During the forming and set processes, oxygen ions will be propelled into the ITO electrode due to its oxygen vacancy-rich property; therefore, we find Schottky emission both at high-resistance state and low-resistance state and that the device exhibits an automatic current compliance property. Varied stop-voltage measurements were carried out to verify the device mechanism. Because of its capability for oxygen storage, the thick ITO layer was confirmed to affect the characteristic due to a difference in oxygen gradient. A new structure and novel material are proposed, based on the devices with ITO electrodes to improve performance and reduce power consumption. [ABSTRACT FROM PUBLISHER]

In this paper, indium-tin-oxide (ITO) was used to act as both insulator and top electrode in resistive random access memory (RRAM) on identical bottom substrates. This is achieved by cosputtering an ITO target with nitride (N2) or oxygen (O2) gas as the insulator; then capping by an ITO electrode, such that both the rectifier and RRAM characteristics can be achieved before and after a forming process, respectively. In contrast, using pure ITO as an insulator does not exhibit RRAM behavior. To verify the rectifier and RRAM characteristics, material analyses and electrical measurements at various temperatures were conducted. Reliability tests including retention and endurance were also applied to verify the resistance switching stability. Finally, the rectifier and RRAM conduction models were proposed to examine the resistance switching behaviors. By applying the ITO material as both electrode and insulator, the resistance switching characteristic with high reliability is thus obtained. [ABSTRACT FROM AUTHOR]

Resistance drift of the amorphous states of multilevel phase change memory (PCM) cells is currently a great challenge for the commercial implementation of a reliable multiple-bit-per-cell memory technology. This paper reports observation of a stable intermediate state for a multilevel PCM cell that is achieved through nonuniform heating with a square current injection top electrode. Drift coefficient of the intermediate state is an order of magnitude lower than reset and has weaker temperature dependence. Using finite-element simulations and an analytical model for the subthreshold current–voltage characteristics, based on thermally activated hopping of charge carriers across Coulombic donor-like traps, we conclude that the defect density is two orders of magnitude larger in the intermediate state. We attribute the low drift coefficient of the intermediate state to a large number of stable interfacial defects which dominate the electron transport. Current findings give way to a more stable ultrahigh-density PCM device. [ABSTRACT FROM PUBLISHER]

There has been a strong demand for developing an ultradense and low-power nonvolatile memory technology. In this paper, we present a carbon-based resistive random access memory device with a carbon nanotube (CNT) electrode. An amorphous carbon layer is sandwiched between the fast-diffusing top metal electrode and the bottom CNT electrode, exhibiting a bipolar switching behavior. The use of the CNT electrode can substantially reduce the size of the active device area. We also demonstrate a carbon-based complementary resistive switch (CRS) consisting of two back-to-back connected memory cells, providing a route to reduce the sneak current in the cross-point memory. The bit information of the CRS cell is stored in a high-resistance state, thus reducing the power consumption of the CRS memory cell. This paper provides valuable early data on the effect of electrode size scaling down to nanometer size. [ABSTRACT FROM PUBLISHER]

In this paper, we investigate in depth Forming, SET, and Retention of conductive-bridge random-access memory (CBRAM). A kinetic Monte Carlo model of the CBRAM has been developed considering ionic hopping and chemical reaction dynamics. Based on inputs from ab initio calculations and the physical properties of the materials, the model offers the simulation of both the Forming/SET and the Data Retention operations. It aims to create a bond between the physics at atomic level and the device behavior. From the model and experimental results obtained on decananometric devices, we propose an understanding of the physical mechanisms involved in the CBRAM operations. Using the consistent Forming/SET and Data Retention model, we obtained good agreement with the experimental data. Finally, the impact of each layer of the CBRAM on the Forming/SET behavior is decorrelated, allowing an optimization of the performance. [ABSTRACT FROM AUTHOR]

In this paper, we have investigated the leakage current versus voltage characteristic of high- k thin film capacitors over a large temperature range. Fabricated samples, consisting of a 10-nm thin {\rm SrTiO}_{3} (STO) layer as a dielectric material and {\rm SrRuO}_{3}$ as electrodes, have been examined. Electrical measurements performed at different temperatures reveal leakage currents that exceed 10^{-7}~{\rm A}/{\rm cm}^{2} at 1 V, a requirement needed for dynamic random access memory (DRAM) applications. We perform a detailed simulation study for the measured samples, making use of a modified drift diffusion model, which also takes into account charge trapping/detrapping effects and nonlocal tunneling. Based on our simulations, we propose an explanation for the large leakage currents observed experimentally. They can be attributed to a trap-assisted tunneling process that is enhanced by oxygen vacancies in the STO dielectric layer. We are thus able to reproduce the temperature and voltage dependence of the measured currents and can use our model to examine the impact of different physical parameters on the behavior of the capacitor structure—a first step toward device optimization. A feasibility analysis is performed for a 1T1C DRAM cell using an optimized deep trench STO capacitor with a reduced oxygen defect density. The simulation results underline the advantages of our modeling procedure using a commercial technology computer aided design (TCAD) framework: once the complex leakage mechanism is implemented, it can be activated on arbitrary 3-D structures, taking advantage of all the postprocessing or visualization capabilities. [ABSTRACT FROM AUTHOR]

A highly transparent resistive random access memory with a configuration of multilayer graphene (MLG)/ Dy2O3 /indium tin oxide (ITO) structure is demonstrated in this paper. The fabricated device is transparent, with 80% transmittance at 550 nm. The MLG/ Dy2O3 /ITO device shows unipolar resistance switching with a low operation current (<100~\muA) , low operation voltage (<1~V) , low power consumption (<100~\muW) , high resistance ratio (>10^4) , fast switching speed (<60~ns) , reliable data retention, and promising cycle endurance properties (>200~cycles) , which makes a step toward the realization of low-power transparent electronics for next-generation nonvolatile memory application. The MLG/ Dy2O3 /ITO device exhibited typical filamentary-conduction-type resistive random access memory behavior and no forming process is required. High resistance state (HRS) increases with a reduced device area while low resistance state (LRS) is insensitive to the device sizes. Moreover, Raman spectra obtained in pristine state, HRS, and LRS indicate that the lower power consumption of MLG/ Dy2O3 /ITO device is attributable to the formation of oxygen graphene layers. [ABSTRACT FROM AUTHOR]

We demonstrate a metal sandwiched Al-doped zinc tin oxide (AZTO) thin-film device to exhibit a characteristic evolution process from Schottky junction diode to resistive-switching random access memory (RRAM) applications. The proposed TiN/Ti/AZTO/Pt device can initially show good rectifying characteristics and high forward-bias current for Schottky diodes. After applying with an electrically triggered forming process, the transition of electrical behavior occurs and evolves from the diode to RRAM characteristics. The RRAM device exhibits the coexistence of bipolar and unipolar resistive-switching modes through the positive-bias forming and reversed-bias forming process, respectively. In addition, the RRAM device with bipolar mode can perform the functionality of multilevel cell storage, while the one with unipolar mode shows stable resistive-switching performance. Furthermore, one-transistor and one-resistor (1T1R) architecture with an RRAM cell connected with a thin-film transistor (TFT) device is developed in this paper. The TFT device using AZTO film as an active channel layer performs good electrical characteristics for a driver in the 1T1R operation scheme. The integration of AZTO-based electronic devices has great potential for increasing the application diversity of metal oxide AZTO thin film as well as the flexibility of circuit design in the emerging optoelectronic technologies. [ABSTRACT FROM PUBLISHER]

Using the model developed in Part I of this two-part paper, the simulated dc sweep and pulse transient characteristics of a metal oxide resistive random access memory cell are corroborated with the experimental data of \HfOx memory. Key switching features such as the abrupt SET process, gradual RESET process, current fluctuation in the RESET process, and multilevel resistance state distributions are captured by the simulation. The current fluctuation in the RESET process is caused by the competition between the simultaneous oxygen vacancy recombination and generation processes. The origin of the high-resistance state variation and the tail bit problem are attributed to the variation of the tunneling gap distances and the stochastic nature of new Vo generation in the tunneling gap region, respectively. The use of the write–verify technique and a bilayer oxide structure are proposed to achieve a tighter resistance distribution. [ABSTRACT FROM AUTHOR]

This paper introduces a novel structure for filamentary-conduction-type resistance change memory. The new structure utilizes the fringing field from the top metal electrode to effectively confine the position of the filaments in the cell. Nanoscale (100–50 nm) memory cells are fabricated using nickel oxide (NiO) thin film as the resistance-switching layer to demonstrate the feasibility and functionality of the new structure. The fabricated nanoscale memory cells achieved low reset current (100–200 \mu\A), narrower distribution in low-resistance states, and higher on/off ratio than those of the standard structure. In addition, good scalability down to 50 nm was demonstrated. [ABSTRACT FROM AUTHOR]

The conduction mechanism and resistive switching properties in a resistive-random-access-memory device composed of Al(top)/TiOx/TiO2/Al(bottom) are investigated in this paper. The active-top-electrode (TE) material aluminum interacted with the TiO2 layer and induced an oxygen-deficient TiOx layer near the TE. The naturally formed oxygen-deficient TiOx layer was confirmed by a transmission-electron-microscope energy-dispersive X-ray spectrometry analysis. The oxygen-deficient TiOx region acted as a trap for electrons and contributed to the resistive switching. The proposed mechanism and measured data are verified through simulation of a two-variable resistor model. [ABSTRACT FROM AUTHOR]