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In this paper, we propose a methodology to model and optimize FinFET devices for robust and low-power SRAMs. We propose to optimize the gate sidewall offset spacer thickness to simultaneously minimize leakage current and drain capacitance to on-current ratio in FinFET. With the source/drain extension doping controlled at the outer edges of the spacer, the thickness of the spacer determines the channel length. Optimization reduces the sensitivity of the device threshold voltage to the fluctuations in silicon thickness (by 32%) and gate length (by 73%). Our analysis shows that optimization of spacer thickness results in 65% reduction in SRAM cell leakage and improves cell read-failure probability (by 200 ×) compared to conventional FinFET SRAM. Access time of an SRAM cell designed with optimized devices is comparable to conventional SRAM. We also compared the optimized-spacer-thickness SRAM cell with one designed using longer gate length and minimum-spacer-thickness transistors. The long-channel-device-based SRAM cell is marginally robust than optimized SRAM; however, increased gate-edge direct-tunneling leakage and parasitic capacitances degrade the power consumption and access time. [ABSTRACT FROM AUTHOR]

This paper studies the application of tunnel FET (TFET) in designing a low power and robust cellular neural network (CNN)-based associative memory (AM). The lower leakage, steeper switching slope, and higher output resistance of TFET are exploited in designing an ultralow-power TFET-based operational transconductance amplifier (OTA). A TFET-OTA is utilized as a programmable synaptic weight multiplier for CNN. The ultralow-power of TFET-OTA enables a higher connectivity network even at a lower power, and thereby improves the memory capacity and input pattern noise tolerance of CNN-AM for low power applications. The TFET-based higher connectivity CNN also exploits the unique characteristics of TFET to improve the throughput efficiency of CNN-AM. [ABSTRACT FROM AUTHOR]

Deposition of a metal gate on high- \kappa dielectric {\rm HfO}_{2} is known to generate oxygen vacancy (OVs) defects. Positively charged OVs in the dielectric affect the gate electrostatics and modulate the effective gate workfunction (WF). Count and spatial allocation of OVs varies from device-to-device and induces significant local variability in WF and V_{th}$ . This paper presents the statistical models to simulate OV concentration and placement depending on the gate formation conditions. OV-induced variability is studied for SOI FinFET, and compared against the other sources of variability across the technologies. The implications of gate first and gate last processes to the OV concentration/distribution are studied. Simulations show that with channel length and gate dielectric thickness scaling, the OV-induced variability becomes a significant concern. [ABSTRACT FROM PUBLISHER]

This paper estimates the temperature distribution within a spin-torque-transfer RAM (STTRAM) cell due to self-heating using a thermal simulation based on the finite volume method. The analysis shows that, due to high switching current and small volume of the magnetic tunnel junction (MTJ), there can be significant rise in temperature in the MTJ as well as the silicon transistor. The impacts of the increased temperature on operational reliability metrics of the STTRAM cell, i.e., read disturb, write failure, and sensing accuracy, are evaluated. It is shown that, due to the self-heating effect, the operational reliability of an STTRAM cell depends on the read–write history of that cell. [ABSTRACT FROM AUTHOR]

Dual-threshold-voltage (VT) CMOS is an effective way to reduce leakage power in high-performance very-large-scale-integration circuits. In this paper, we explore the technology design space for dual-threshold-voltage transistor design in deep-sub-100-nm technology nodes. We propose a technique of achieving high-VT (HVT) devices using thicker gate-sidewall offset spacers to increase the channel length without increasing the printed-gate length. The effectiveness of all the dual-VT technology options--increasing channel doping, increasing gate length, and proposed technique of increasing spacer thickness--is analyzed at transistor and basic logic gate level. Results on 65-nm partially depleted silicon-on-insulator and double-gate technologies indicate that the proposed technique yields lower dynamic power consumption and lower performance penalty compared with longer gate length and high body-doping devices. Our proposed technique, however, incurs extra fabrication mask similar to achieving HVT by increasing body doping. [ABSTRACT FROM AUTHOR]