1. Modeling of Packaged MEMS Thermal Wind Sensor Operating on CP Mode
- Author
-
Ming Qin, Qing-An Huang, Ye Yizhou, and Zhenxiang Yi
- Subjects
010302 applied physics ,Physics ,Astrophysics::High Energy Astrophysical Phenomena ,Thermal wind ,Wind direction ,Thermal conduction ,01 natural sciences ,Wind speed ,Electronic, Optical and Magnetic Materials ,Computational physics ,Forced convection ,Thermal conductivity ,Physics::Space Physics ,0103 physical sciences ,Astrophysics::Solar and Stellar Astrophysics ,Electrical and Electronic Engineering ,Physics::Atmospheric and Oceanic Physics ,Voltage ,Wind tunnel - Abstract
Modeling of the packaged wind sensor operating on constant power (CP) mode is proposed in this paper. The proposed model is based on the theory of heat conduction and forced convection. The presented model indicates that the total output dc voltage is proportional to the square root of the wind speed, and ${V}_{x}$ , as well as ${V}_{y}$ , varies with the wind direction based on cosine function. The wind sensor is fabricated by microelectromechanical systems (MEMS) technology and packaged with the glue. The test is performed in the wind tunnel and the measured results indicate an agreement with the presented model. The relative error of voltage for the wind speed is less than 14% up to 30 m/s, while that for the wind direction is no more than 10.7% from 0° to 360°.
- Published
- 2019