1. Advances in Planar Coil Processing for Improved Microinductor Performance.
- Author
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Anthony, Ricky, Wang, Ningning, Kulkarni, Santosh, and Mathuna, Cian O.
- Subjects
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ELECTROMAGNETS , *ELECTRIC inductors , *PERFORMANCE evaluation , *CONSTRAINTS (Physics) , *ELECTROFORMING , *ELECTRIC resistance - Abstract
This paper examines the process challenges in developing high aspect-ratio copper structures for improving microinductor performance. With increased miniaturization, increasing windings losses become a major challenge limiting the microinductor efficiency. It was also identified that within constraint footprints coil thickness to spacing ratio increase can reduce dc resistance significantly. In this paper, we present a reliable process for developing high aspect ratio ( $\sim 5.8$ ) resist moulds for copper electrodeposition. This resist provided coil spacings 10 $\mu $ m for 58 $\mu $ m resist thickness; this in turn reduces the dc resistance of a typical microinductor by more than 17% when compared with a similar device reported previously. [ABSTRACT FROM AUTHOR]
- Published
- 2014
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