1. Ultra-Broadband Modulator Packaging for Millimeter-Wave Applications.
- Author
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Macario, Julien, Mercante, Andrew, Yao, Peng, Zablocki, Alicia, Shi, Shouyuan, and Prather, Dennis W.
- Subjects
ULTRA-wideband devices ,ELECTRONIC packaging ,MILLIMETER wave devices ,ELECTRONIC modulators ,RADIO frequency ,COPLANAR waveguides - Abstract
This paper reports the RF packaging design for electrooptic modulators operating in the millimeter-wave domain and discusses the RF and optical performances of the module. An \LiNbO3 phase modulator has been integrated in a compact housing offering a 1.0-mm RF coaxial input connector. A coplanar waveguide on a low dielectric-loss alumina substrate has been designed to transition the RF field from the connector to the modulator. A RF insertion loss in the 1–2.5-dB range has been measured for the module over the 70–110-GHz bandwidth. A half-wave voltage comprised between 8.6 V at dc and 20 V at 110 GHz was calculated based on the observation of the optical modulation sidebands over the entire 110-GHz bandwidth. The optical insertion loss of the module was measured at 2.8 dB. [ABSTRACT FROM AUTHOR]
- Published
- 2014
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